Exclusive: Nexperia cuts wafer supplies to Chinese plant, ratcheting up chip disruptions - Reuters
Exclusive: Nexperia cuts wafer supplies to Chinese plant, ratcheting up chip disruptions Reuters
October 31, 2025
In electronics, a wafer is a thin slice of semiconductor, such as a crystalline silicon, used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit.
Exclusive: Nexperia cuts wafer supplies to Chinese plant, ratcheting up chip disruptions Reuters
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October 28, 2025■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck) : <br /> <br />Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents. <br /> <br />Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel. <br /> <br />Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials. <br /> <br />■ Adsorbable Material <br />(1) Metal conductor (e.g., copper foil) <br />(2) Semiconductors (e.g., silicon, GaAs) <br />(3) Insulators (e.g., paper, glass substrate) <br />(4) Porous objects. <br />(5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness. <br />(6) Material ranking of the adsorption force per unit area is : Metal 1st, Semiconductors 2nd, Insulator 3rd. <br /> <br />■ Operational Environment <br />(1) Atmospheric Pressure. <br />(2) Vacuum Environment. <br /> <br />■ Main Handling Applications <br />(1) Thin and large size flat glass. <br />(2) Semiconductor thin wafers. <br />(3) Big Size Wafer Handling and Moving. <br />(4) Warp wafers. <br />(5) Move-Free Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck). <br />(6) Soft copper foil. <br />(7) Soft film. <br />(8) Curved glass. <br />(9) Vacuum Lamination for OLED or Touch Panel. <br />(10) Vacuum deposition. <br /> <br />■ Main Products <br /> <br />① (Move-Free) Thin Wafer Supporter <br />1. Be able to keep adhesion without power source connection. <br />2. Need connect controller for about 30 seconds to switch the adhesion state. <br />3. After adhesion setting, move-free supporter can keep adhesion status even disconnecting power. <br />4. Maximum operating temperature: 250 degrees centigrade. <br />5. Suitable for soft and thin object carriers. (Eg, thin wafer, thin glass panel, 4"wafer-on-6"chuck Shape Reinforcement Carrier). <br /> <br />② (Wired) Stage Holder <br />1. Real time power switch to set adsorption or release. <br />2. Maximum operating temperature: 200 degrees centigrade (E-Chuck surface). <br />3. Suitable for automation equipments. (Eg, curved glass, borderless screen, OLED vacuum Lamination.) <br /> <br />③ (Cordless) Palm: <br />1. Use battery as power source. <br />2. Suitable to adhere small and lightweight objects. (Eg, 12 "wafers, 7" flat glass.) <br /> <br />④ Other Custom E-Chuck: <br />1. Patent Cordless Holder (built-in battery, suitable for conveying lightweight objects) <br />2. Patent Electric Belt (curved cylinder shape E-Chuck) (Eg, Paper Printer.) <br />3. Anti-wrinkle E-Chuck (Eg, soft copper foil.) <br /> <br />Contact info : <br />E-mail : sales@edragontek.com <br />EDRAGON TECHNOLOGY CORPORATION
PAM-XIAMEN produce wide range of Compound Semiconductor Wafer and LED wafer substrate - single crystal wafer: Silicon Carbide Wafer, Gallium Nitride Wafer(Substrate), Gallium Nitride HEMT,GaAs Wafer,Gallium Arsenide Wafer,Germanium Wafer,GaN substrate, CZT Wafer,GaN Template, InGaN Wafer, AlGaN Wafer,GaN epiwafer, GaN Epitaxial Wafer More information visit our web site : http://www.powerwaywafer.com/
SEO OR "digital marketing"SEO AND auditdefine:semanticssite:example.com SEO tipsintitle:"on-page SEO"filetype:pdf SEO checklistrelated:moz.com"technical SEO guide"SEO audit -paid"best * practices"SEO trends after:2024SEO AROUND(3) auditinurl:"keyword research"intext:"link building"In electronics, a wafer is a thin slice of semiconductor, such as a crystalline silicon, used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit.
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“Better the cottage where one is merry than the palace where one weeps.”
How many bones are in the human hand?
A handful of them.